Epoxy hardener / accelerate agent

Thiols can be combined with other curing agents such as amines, acid anhydrides and phenols.
It is suitable for low temperature epoxy resin curing systems in combination with base catalysts.
The secondary thiol has the properties such as water resistance and composition stability compared with traditional primary thiols.
In addition, it can be used as a accelerator and can also improve low temperature curing and durability to the original composition.

Improved composition stability

Improves pot life ( stability ) compared to first grade thiols.

About curing system

In the case of an equal amount reaction, the mercapto group has high reactivity, and the thiol structure contributes to the flexible properties.
In the case of small amount addition system, as a reaction accelerator, it imparts characteristics such as relaxation of conventional curing conditions, toughness, high strength and high Tg.
In other words, it can be control curing speed and characteristics according to customer needs.

• Case-1：Epoxy group>>SH group

  

  ・Reduction of curing temperature
  ・High heat resistance ・ High Tg
  ・Adhesion improvement

• Case-2：Epoxy group≒SH group

  

  ・Low temperature curability
  ・High flexibility

• Epoxy resin only

  

  ・Requires high temperature curing
  ・High hardness & brittleness

• 

Rapid curing / low temperature curing

Reactive faster than amine hardeners.

Basic composition: jER828 / Polyamide amine ＝ 100 / 100
Add PE1: jER828 / Polyamide amine / PE1 ＝ 100 / 100 / 35
PE1 only: jER828 / Polyamide amine ＝ 100 / 70

PE1 addition effect

By adding a small amount of PE1, the curing time to complete curing can be shortened.
It can also lower the curing temperature.

Curing condition and Tg

Tg is the inflection temperature of elongation.

Tensile properties

Compliant with JIS_K_6911

Application example to epoxy / acid anhydride curing system

Even in epoxy / acid anhydride curing systems, the curing conditions can be reduced by adding a small amount of PE1.
Depending on the amount added, strength and flexibility will improve.

Adhesion

Tensile / shear test

Cured products using KarenzMT PE1 have higher adhesive strength than amine cured products.

Water / Solvent resistance

	Water resistance Immerse the cured product in hot water at 98 ℃ for 24 hours.		Acid / Alkali resistance Cure at room temperature and soak at 23 ℃ for 7 days
	Before	After test	5% NaOHaq.	5% HClaq.
KarenzMT PE1	Stable		Almost stable
Modified amine	Whiten		Swelling ( 5%HClaq. )
PETMP※1	Soften & Whiten		Dissolution ( 5%NaOHaq. )

Transparency

Transparency is improved by increasing the amount of PE1 added.
Curability also changes greatly depending on the amount added.

PE1 amount（phr）		0	5phr	10phr	40phr	70phr
SH-Group/Epoxy-Group		0.00	0.07	0.14	0.56	1.00
The temperature at which the epoxy group reacts completely （ Curing temp： 1Hr ）		180	150	150	100	100
Color	b* ( 0.5mm thickness )	79	36	18	0.5	0.2
Tg	℃ ( DMS )	143	163	135	45	49
Tensile test	Elastic modulus ( GPa )	2.7	2.7	2.8	3.2	3.1
	Elongation ( % )	2.1	2.6	3.3	1.4	17
	Breaking strength ( MPa )	37	41	50	31	24

Compliant with JIS_K_6911

You can also make a highly transparent cured product by changing the composition.

Formulation
Epoxy resin / PE1 / （ left： Amine catalyst , light： Phosphorus catalyst ） ＝ 100 / 70 / 3
Curing condition：40℃－30min

The information contained herein is based upon data considered true and accurate. However, Resonac Corporation accepts no responsibility or risk which may result from the handling and use of products or for infringement of any patent.
※1　PETMP is an abbreviation for pentaerythritol tetra (3-mercaptopropionate).