CAS No.3126-63-4
Pentaerythritol tetraglycidyl ether
Shofree PETG
PETG has quaternary carbon and it is tetrafunctional thus it forms a three-dimensional network.
It has high adhesive strength and crosslink density, and has excellent properties such as a flexible skeleton, hard coat property, and high heat resistance.
In addition, because of its high purity, it has a low viscosity and has good storage stability and weather resistance at high temperatures.
Merit
High crosslinking, 3D structure, Hard-coat
Total Cl
＜50ppm
Physical property information
スクロールできます| PETG | Others | Method | ||
|---|---|---|---|---|
| Color |  Clear |
 Light yellow |
Appearance | |
| Epoxy equiv. ( g/eq ) | 90～100 | ＜240 | Titration | |
| Epoxy yield ( % ) | ＞90 | ＜40 | ||
| Viscosity ( mPa･s ) | 30℃ | 310 | 750 | E-type viscometer |
| 90℃ | 45 | Gelation | ||
| Total Cl ( ppm ) | ＜50 | ＜50,000 | Ion Chromatogram | |
| Toxicological Information | |
|---|---|
| Acute toxicity | Oral Rat LD: 50: 300 ~ 2000mg/kg |
| Mutagenicity | Ames test positive |
| Chemical registration | |
|---|---|
| Japan | ENCS： Main・(7)-1280 Registered |
| Oversea | EU ( EINECS ）、CHINA（※as main substance） |
Purity - Comparison with the epichloro method（ ECH Method ）－
Column： Shodex GPC KF-LG + GPC KF-802 ×3，40℃
Eluent: Tetrahydrofran ( HPLC Grade ),1.0ml/min Detector：RI
Property of cured material
Heat resistance
*TMA Method ( temp 10℃/min raising )
| Curing condition | Catalyst = Shikoku Curezol 2E4MZ ( 1wt% ) 150℃ 1h + 200℃ 2h |
|---|
Mechanical property>
スクロールできます| Tg [℃] | CTE [ppm] | Hardening shrinkage [%] | Water absorption [%] | Surface hardness* | |
|---|---|---|---|---|---|
| PETG（ Showa ） | 190.9 | α1 82 α2 153 |
3.11 | 3.5 | 8~9H High strength |
| Others （ ECH method ） | 33 | α1 77 α2 209 |
3.37 | 3.1 | ~3H |
| Curing condition | Photo-cation hardener ( CPI100 ) Hg lump 900mJ/50s |
|---|
It has High-Tg and High-Surface hardness than others.
Property of cured material
Color resistance
It has good color resistance same as hydrogenated Bis-A epoxy.
※The information contained herein is based upon data considered true and accurate. However, Resonac Corporation accepts no responsibility or risk which may result from the handling and use of products or for infringement of any patent.