CAS No.14228-73-0

1,4-cyclohexanedimethanoldiglycidylether

Shofree CDMDG

1,4-シクロヘキサンジメタノールジグリシジルエーテルの図

CDMDG has an alicyclic structure, it has excellent properties such as hydrophobicity, low water absorption, and low dielectric property.
In addition, it has low molecular weight and liquid at room temperature, so it has good affinity with various epoxies.

Merit

Low water absorbency, Low dielectric, Liquid in r.t.

Total Cl

<50ppm

Physical property information

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CDMDG Others Test method
Color Clear
Clear
Light yellow
Light yellow
Appearance
Haze meter L 99.6 99.9 Haze meter
a -0.09 -0.53
b 0.7 2.14
Viscosity ( mPa・s/25℃ ) 30 37 E-type viscometer
Epoxy equiv. ( g/eq ) 136 135 Titration
Total Cl ( ppm ) 4.8 503 Combustion/Ion Chromatogram
Purity ( % ) 91.6* 89.7* GC
*Allyl 8%
*Chloride,polymer 10%
Toxicological Information
Acute toxicity Oral Rat LD50 300~2,000㎎/kg
Mutagenicity Ames test positive
Chemical registration
JAPAN ENCS: Registered
Oversea EU(EINECS, REACH), USA(TSCA), CANADA(DSL), KOREA, CHNIA(※as main substance)

Property of cured material

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Reference SDK Other SDK Other SDK Other
Bis-A-Epoxy 100 80 50 0
CDMDG 0 20 50 100
MeHHPA※1 87.5 90.3 98.9 110
2E4MZ※2 0.94 0.95 0.99 1.05
Silica 211
Tg [℃] 154 140 143 124 127 94 102
CTE α1 78 80 84 81 79 86 86
α2 150 180 180 180 180 180 170
Bending strength [MPa] 138 119 130 108 119 90 93
Elastic modulus [GPa] 2.76 2.67 2.64 2.56 2.46 2.37 2.23
Water absorption 0.52 0.86

※1: Methyl hexahydroxyphthalic acid anhydride
※2: 2E4MZ

Curing condition
Bis-A type Epoxy Epoxy equiv. 173g/eq Viscosity 4450mPa・s
Silica filler Average diameter 2.2μm
100℃, 1hr+120℃, 1hr+180℃, 2hr
Water absorption test 130℃‐100%RH 100hr

CDMDG has similar usage method and properties of cured material.
It has good water absorption than others.

Electrical reliability

Test condition Temp 85℃, Humidity 85%RH
Voltage 100V
L/S = 50/50 Pitch width 100μm

It has high electrical reliability by halogen-free.

※The information contained herein is based upon data considered true and accurate. However, Resonac Corporation accepts no responsibility or risk which may result from the handling and use of products or for infringement of any patent.